Product Name: |
SPD/OVP chips series |
Description: |
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Features: |
1. Silver metalized for solder assembly
2. Bidirectional crowbar protection
3. High repetitive surge capability
4. Low capacitance
5. Low leakage current
6. Fast response time
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Other Description: |
Main Applications
1. Customer Premises Equipment (CPE) such as phone, modems and caller ID adjunct boxes
2. T-1/E-1, ISDN, xDSL and VoIP transmission equipment
3. Data lines and security systems
4. Primary protection including main distribution frames, building entrance equipment and station protection modules
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| This is the detailed information for W series, SPD/OVP chips series. The information includes model, name, description and specification for W series, SPD/OVP chips series. Related Keywords : SPD/OVP chips, SPD?OVP dice, Sidactor chips, Sidactor dice |
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